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Your search returned 9 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
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Year : 1997 Volume number : 20 Issue: 02 |
Study Of Tantalum Oxide Thin Film Capacitors On Metallized Polymer Sheets For Advanced Packaging Applications
(Article)
Subject:
Author:
page:
117
-
122
Direct Computation Of Capacitance In Integrated Passive Components Containing Floating Conductors
(Article)
Subject:
Capacitance
,
Finite Difference
,
Floating
Author:
George J.
Cokkinides
Benjamin
Beker
Douglas M.
Templeton
page:
123
-
128
Multiconductor Transmission Line Characterization
(Article)
Subject:
Coupling
,
Electromagnet
,
Measurement
Author:
Dylan F.
Williams
page:
129
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132
Etch Alignment Of Ccd Mosaic Hybrid
(Article)
Subject:
Micromachines
,
Mosaic
Author:
S J
Chapman
V. S
Parameswaran
E.
Burley
page:
133
-
140
Controlled Solder Interdiffusion For High Power Semiconductor Laser Diode Die Bonding
(Article)
Subject:
Angle-Facet
,
Die Bond
,
High Power
Author:
Scott A.
Merritt
Peter J. S.
Heim
Mario
Dagenais
page:
141
-
145
Thermosonic Bonding Of An Optical Transceiver Based On An 8×8 Vertical Cavity Surface Emitting Laser Array
(Article)
Subject:
Flip-Chip
,
Vcsels By Elliqtic Surface Etching
,
Multichip Module
Author:
Timothy S.
Mclaren
Sa Yoon
Kang
Yung-Cheng
Lee
page:
152
-
160
Aging Studies Of Cu-Sn Intermetallic Compounds In Annealed Surface Mount Solder Joints
(Article)
Subject:
Intermetallic
,
Reliability
,
Surface Mount Technology
Author:
Alex C. K.
So
J. K. L.
Lai
Yan C.
Chan
page:
161
-
166
The Effect Of The Oxidation Of Cu-Base Leadframe On The Interface Adhesion Between Cu Metal And Epoxy Molding Compound
(Article)
Subject:
Adhesion
,
Copper Oxide
,
Leadframes
,
Surface
Author:
Soon-Jin
Cho
Kyung-Wook
Paik
Yong-Ju
Kim
page:
167
-
175
Numerical Stress Analysis Of Resin Cracking In Lsi Plastic Packages Under Temperature Cyclic Loading. Ii. Using Alloy 42 As Leadframe Material
(Article)
Subject:
Delamination
,
Finite - Element Analysis
,
Fracture
,
Temperature
Author:
Takehiro
Saitoh
Masayuki
Toya
page:
176
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183
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